Enthone® PWB fabrication chemistries are widely specified and used by the world's leading PWB fabricators, assemblers and OEMs. Our lead-free final finishes are the industry's leading and most trusted alternatives to hot air solder leveling and include a comprehensive line of organic solderability preservatives, immersion silver, as well as other metallic alternatives to meet today's most complex PWB challenges. Enthone direct metallization processes, acid coppers, oxide alternatives, and solder masks have become the industry standards for high yields and trouble-free fabrication.
Please select a Trade Name, Application, or Process from the above menus to view product details within the PWB Fabrication Chemistry section of the Enthone web site.
Process
Cleaners and Conditioners
Equipment Cleaners
Microetches
Oxides and Oxide Alternatives
Desmear Etchback Removal
Electroless Copper Processing
Direct Metallization
Electroplate
Electrolytic Copper/Tin
Deep Tank Electrolytic Nickel/Gold
TAB Electrolytic Nickel/Gold
Tin/Tin-Lead Stripping
Imaging Technologies
Dry Film Resists
Primary Resists
Thermal Cure Solder Masks
Nomenclature Inks
Solder Mask Stripping
Screen Cleaners
Resist Strippers
Developers
Defoamers
Final Finishes (HASL Alternatives)
Hot Air Solder Leveling
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Final Finishes (HASL Alternatives) |
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Americas
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Immersion Tins |
Extremely stable immersion tin processes based on a patented, Organic Metal® predip reduces Cu/Sn diffusion speed by as much as 65% and catalyzes the Sn deposition. As a result, exceptional solderability and appearance, even after multiple lead-free assembly reflows, is achieved. The surface finish has the industry's longest shelf life. An organic metal predip is available to reduce whisker growth before assembly. |
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Tin Nanofinish® |
Patented, immersion tin nanofinish® produces a thin, 0.35 micron tin coating that decreases processing time, energy usage and equipment costs. The Organic Nanometal® process employs patented Organic Metal technology to prevent solder mask attack, discoloration and other defects commonly associated with conventional immersion tin processes. ORMECON CSN Nano offers exceptional solderability, regardless of the amount of free pure tin that remains on the surface, as the organic nanometal protects the copper-tin intermetallic from being oxidized. The process may be safely used in lead-free, multi-step assembly processes. |
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Organic Metal-based, Nanofinish® |
OrmeSTAR Ultra is an Organic Metal-based final finish. This revolutionary, patented nanofinish technology consumes approximately 90% less energy and creates less waste versus electroless nickel / immersion gold (ENIG) and other traditional metallic final finishes. When compared to ENIG, OrmeSTAR Ultra reduces process time by 75%. The finish costs 30% less then ENIG, with no "black pad" risk. The versatile process delivers a high efficiency in application and operation throughout the entire supply chain. To view or download further details (right click, "Save Target As"), click here. |
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