< PWB Fabrication Chemistry Chart
PUR-A-GOLD® 540
Pure Gold Electroplating Process
Soft gold process produces high purity, lemon-yellow gold deposits. Specifically designed to provide superior distribution for deep tank plating of COB technology. Fine grained deposit ensures consistent bonding results and uniform appearance. Exceptional distribution minimizes overplate and reduces gold usage. Low gold content in solution reduces precious metal inventory. Stable and controllable electrolyte is fully analyzable, reducing downtime and improving process control.
| FEATURES |
BENEFITS |
| Fine-grained deposit |
Consistent bonding results
Uniform appearance
|
| Exceptional distribution |
Minimizes overplate
Reduces gold usage
|
| Low gold content in solution |
Reduces precious metal inventory
Reduces drag-out and refining costs
|
| Stable and controllable
electrolyte |
Fully analyzable
Consistent deposit properties
Reduces downtime and rejects
Improves process control
High metallic impurity tolerance
|
| Non-thallium, non-arsenic
grain refiner |
Meets all military and commercial
specifications, including MIL-G-45204C
Stable, non-oxidizable system
|
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