< PWB Fabrication Chemistry Chart

PHOTEC* Dry Film Photoresists

Consistently provides the highest first-pass yields on fine line, high circuit density PWBs. Featuring exceptional resolution capabilities, each resist exhibits outstanding substrate conformance while delivering strong, flexible tent and etch benefits. Compatible with all electrolytic and etching processes, the resists maintain a controlled particle size, enabling ease of stripping. Outerlayer imaging resists specially formulated for tin, tin-lead, deep tank electrolytic nickel and gold applications. Featured products include:

PHOTEC H-6800 Series: High performance resist technology for high speed production. Available in 40, 45 and 50 micron thicknesses.

PHOTEC H-6200 Series: Multifunctional resist technology engineered for fine line circuitry. Available in 30, 40, and 50 micron thicknesses.

PHOTEC U-6300 Series: Resist material for high alkaline resistance. Available in 40 and 50 micron thicknesses.

PHOTEC H-N 650: 50 micron dry film resist, suitable for deep tank electrolytic nickel and gold applications.

PHOTEC H-8250: Resist for Secondary Imaging Technology (SIT) process. Suitable for electroless nickel and immersion gold applications.

PHOTEC SL-1200 Series: 30 and 40 micron resists for laser direct imaging applications. (50 um on request possible)

PHOTEC Technical Process Guide and Troubleshooting Manual: Ensures successful operation of PHOTEC dry films.

For more information, please click here and request via email.

*Trademark used under license from Hitachi Chemical Co., Ltd.

RESOURCES

Fact Sheets/Brochures
PHOTEC 6200 Series Dry Film