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ENBOND® XTRA
Oxide Technologies
ENBOND MB-500 oxide produces oxide films with a crystal morphology that ensures excellent bonding of copper and resin during lamination of multilayer circuit boards. Available in America, Europe, and Asia.
ENBOND XTRA oxide reducer eliminates the formation of pink ring in multilayer PWBs. The process converts black oxide coatings used in multilayer fabrication to an acid resistant form without modifying the surface structure, thus providing enhanced adhesion properties. ENBOND XTRA protects the surface from oxidation during baking cycles. Available in America, Asia and Europe.
ENBOND XTRA Stabilizer is used to enhance performance and extend solution life of the ENBOND XTRA oxide reducer. Available in America, Asia and Europe.
Benefits
- Eliminates Pink Ring
- Ideally Suited For Direct Metallization
- Strengthens Copper to Resin Bond
- High Bond Strengths
- Simple Control and Operation
- Produces Chemically Resistant Coating
- Easy to Waste Treat
- Vertical or Horizontal Application
- Low Temperature Operation
- Resistant to Acid Attack
- Short Immersion Times
- Consistent and Reliable Process
- Exceptional Bath Stability
- Easy to Analyze and Control
Processing Advantages
- Proven in High Volume Production
- Vertical or Horizontal Application
- Demonstrated Pink Ring Elimination
- Easier to Waste Treat
- Low Operating Cost
- Easy to Control
- Predictable Results
For more information, please click here and request via email.