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AlphaPREP® PC-7030

AlphaPREP PC-7030 is specially formulated for low etch/high capacity operations using horizontal equipment. The patented and environmentally friendly peroxide-sulfuric based chemistry produces an organo-metallic coating that delivers exceptional bonding performance between dielectric and copper at very low copper etch factors. Technical benefits include improved high Tg peels, reduced water usage and wastewater generation, and enhanced resilience to pre-lamination baking. AlphaPREP PC-7030 produces a textured, acid resistant surface that eliminates “pink ring” and provides a reliable copper-to-dielectric bond that does not deteriorate with multiple thermal excursions. The exceptional copper loading capacity ensures low operating process cost.

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