ViaForm®

Enthone ViaForm copper damascene electrochemical deposition processes for wafer fabrication provide superior filling performance. The latest generation is designed to master the complex process requirements of sub-90 nanometer interconnects, with extendibility to 65 nanometer nodes. Unique characteristics of the process chemistry include:

Superior Filling Performance
- 65 nm capable
High CMP Compatibility
- Improves yields and aids forward integration through lower defect counts
Fully Analyzable Process
- Alternative metrology methods available
Steady State Process
- Consistent physical properties
- Reliable functional performance
Robust Technology
- Stable
- Broad operating window
- Ease of process control
- Lowest cost of ownership
Tool Specific Process

ViaForm chemistry is produced in Enthone's high volume manufacturing (HVM) facility and applications laboratories based in Connecticut USA. The HVM exceeds Class 1000 packaging requirements and features computer integrated manufacturing, including on-line particle count, fully automated and enclosed chemical distribution, and dedicated processing streams. The facility ensures stringent batch-to-batch control and consistency, readily meeting the demanding manufacturing requirements of semiconductor producers worldwide.

Used by the world's major semiconductor manufacturers, ViaForm chemistry provides superior filling performance in high-volume facilities, with a reduction in product defects and proven integration into chemical-mechanical planarization (CMP) processes.

ViaForm chemistry is exclusively marketed and distributed worldwide by ATMI, Inc., Danbury, Connecticut, USA.

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