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SILVREX® White Metal Technology
SILVREX S silver electroplating process yields a mirror bright, soft white, silver deposit. Specifically designed for high volume applications where dragout is minimal, SILVREX S deposits are extremely ductile and have excellent solderability. Because the process does not contain a metallic brightener, it may be used for electrical and electronic, as well as decorative applications.
SILVREX hard, bright silver processes also available by contacting your Enthone representative.
| SILVREX S |
| Type |
Silver |
| Purity % |
99.9 |
| Color |
White/Silver |
| Hardness mHV 20 |
90 - 100 |
Plating Time*
(@15 A/ft2 for 2.5µ) |
2.5 |
| Deposit Density (g/cc) |
10.5 |
| pH |
11.5 - 12.5 |
| Precious Metal Content |
32 g/l |
Deposit Weight
for 2.5µ (100µin) |
2.63 mg/sq cm (16.93 mg/sq in) |
| Current Density (A/dm2) |
1.0 - 1.5 |
Plating Rate
(mg/amp-min) |
67 |
| Time to Plate 1 Micron |
1.5 - 2.0 minutes |
| Bath Type |
Cyanide |
| Temperature |
64 - 86°F (18 - 30°C) |
*2.5µ=100µin., 0.25µ=10µin., 0.125µ=5µin, (µ=micron; µin=microinches)
For more information, please click here and request via email.